In an SMD (Surface Mount Device) LED display module, the three color LED chips of red, green and blue are recombined into one pixel. The long LED pins or legs are removed and the LED chip is now mounted directly on the PCB board.

Since three colors of lights are combined into one pixel, the size of SMD LEDs is smaller. Compared with DIP technology, modules of the same size can install more lamp beads. More LED lamp beads help the display module have Smaller pixel pitch and higher pixel density, so higher visual resolution can be easily achieved. SMD LED displays are the most popular choice for any indoor application due to their high quality images and wider viewing angles.

GOB LED technology uses the same patch LED lamp bead method as SMD. The difference is that GOB applies an epoxy resin protective layer on the surface of the lamp bead. Bring waterproof, dustproof,anti-static, and anti-collision functions to the LED display.

In order to achieve close viewing and higher resolution, current LED lights will be made smaller, and smaller LED lights are easily damaged, and rental screens will inevitably be bumped during frequent installation, disassembly, and transportation. GOB technology can also avoid irreversible losses caused in this process.

COB (Chip on board) refers to packaging the LED light-emitting chip directly on the PCB board. Compared with SMD, COB packaging technology does not require reflow soldering. The IC chip is directly attached to the PCB board, and wiring, testing, and dispensing become The finished product has reduced a lot of SMD packaging processes, making the lamp beads more stable and the lamp bead spacing lower, realizing the conversion of the LED display unit from "point" light source to "area" light source, effectively improving the viewing comfort of the LED display. strength, protection, safety and reliability, and are mostly used in fine-pitch ultra-high-definition display solutions.